Microdisplay based immersive headset

ABSTRACT

An immersive headset device is provided that includes a display portion and a body portion. The display portion may include microdisplays having a compact size. The microdisplays may be movable (e.g., rotational) relative to the body portion and can be moved (e.g., rotated) between a flipped-up position and a flipped-down position. In some instances, when the microdisplays are flipped up, the headset provides an augmented reality (AR) mode to a user, and when the microdisplays are flipped down, the headset provide a virtual reality (VR) mode to the user. In certain implementations, the headset includes an electronics source module to provide power and/or signal to the microdisplays. The electronics source module can be attached to a rear of the body portion in order to provide advantageous weight distribution about the head of the user.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims priority to co-pending U.S. provisional patentapplication Ser. No. 62/068,467 titled “Micro-Display Based ImmersiveHead Set Apparatus and Methods,” filed on Oct. 24, 2014, the disclosureof which is herein incorporated by reference in its entirety.

TECHNICAL FIELD

In general, various embodiments of this invention relate to displaytechnology and, more specifically, to microdisplay technologyincorporated into immersive headset devices.

BACKGROUND

Immersive head mounted displays (HMDs) in which a virtual reality (VR)or an augmented reality (AR) is displayed to a user include applicationsin outdoor activities (e.g., hunting, fishing, bird watching), combattraining, and video gaming, among others. Conventional immersive HMDsincorporate relatively large (e.g., 4 inches×2 inches), low-resolutiondisplays similar to those found in smartphones, as well as off-the-shelfcommercial lenses. Such displays place limitations on the size,configuration, and function of current HMDs. In addition, conventionalHMDs position the displays and associated electronics at a singlelocation (e.g., front) of the headset. This generates a location ofhighly concentrated weight that can be distracting to a user. Forexample, many prior art HMDs feature an unbalanced, heavy masscantilevered at the face of the user. Moreover, location of theelectronics at the front of the headset can result in cable placementthat is disorganized and distracting to the user.

SUMMARY OF THE INVENTION

An immersive headset device is provided that, in some embodiments,incorporates microdisplay technology, which results in a headset havinga smaller form factor and/or more compact configuration thanconventional headsets. The headset may include a body portion adapted tobe worn on a user's head and a display portion adapted to house one ormore displays (e.g., microdisplays). The display portion can move (e.g.,rotate or translate) with respect to the body portion between aflipped-down position, in which the displays are directly in the user'sline-of-sight; and a flipped-up position, in which the displays aredisplaced from the user's line-of-sight. The flip-up/flip-downcapability can also enable the headset to feature a VR mode and an ARmode. Alternatively, the displays can slide up/down or to each side. Insome instances, the headset is in AR mode when the display portion isdisplaced from the user's line-of-sight (e.g., flipped-up), but stillprovides an image to the user, for example, by reflecting the image tothe user off a reflective structure. When the headset is in AR mode, auser may see into the real world, but also be provided withenhanced/virtual optics, as well. In other instances, the headset is inVR mode when the display portion is directly in the user's line-of-sight(e.g., flipped-down).

In various embodiments, the headset may also feature an electronicssource module that provides signal and/or power to the displays. Theelectronics source module may be located on the body portion at the rearof the user's head, which can result in improved weight balance aboutthe user's head than conventional headsets. Cables from the electronicssource module may run along semi-rigid side frames, and in some casesthrough a hinge (connecting the display portion and body portion) intothe displays. The side frames may be connected about the rear of theuser's head with a head strap assembly. In some instances, theelectronics source module may form part of the strap assembly and ensurethe assembly is located in the appropriate location on the user's head.In various implementations, the electronics source module can supportsingle and/or dual inputs/outputs, and data in 2D and/or 3D formats. Incertain instances, the display portion also features various adjustmentmechanisms (e.g., interpupillary adjust, diopter adjust, alignmentadjust, and/or in/out adjust). Such mechanisms may be manufactured aspart of the display portion in a single OEM device. In some cases, theadjustment mechanism(s) can be engaged without requiring removal of theheadset from a user's head.

In general, in one aspect, embodiments of the invention feature animmersive headset device. The headset may include a body portion adaptedto be worn on a head of a user and a display portion movably attached toa front of the body portion. The display portion can have at least onedisplay and may move between an immersed position in which the displaysare in a line-of-sight of the user and a non-immersed position. Theheadset may also include an electronics source module for housing atleast one of power and display signal electronics located at a rear ofthe body portion.

In various embodiments, the body portion may include semi-rigid sideframe members, and in some cases, a strap assembly for connecting thesemi-rigid side frame members about the rear of the head. Theelectronics source module may form part of the strap assembly, and insome instances, is shaped to hold the strap assembly in an appropriatelocation on the head. In some instances, the display portion alsoincludes a diopter adjust mechanism and an interpupillary distanceadjust mechanism. In such instances, at least one of the diopter adjustmechanism and the interpupillary distance adjust mechanism may be to beadjusted without removing the headset from the head of the user. In someinstances, the display may include one or more microdisplays, which insome cases, have a diagonal dimension in a range from about 0.5 inchesto about 1.5 inches. The microdisplays may display an image having aresolution of 1024×576, 1152×648, 1280×720, 1600×900, 1920×1080,2560×1440, 3840×2160, and/or 1366×768. In some cases, the headset mayinclude two microdisplays, one for each eye of the user. In such cases,each microdisplay may receive an independent input from the electronicssource module.

In various embodiments, the display portion may move between theimmersed position and the non-immersed position by rotating with respectto the body portion. In such embodiments, the headset may include ahinge mechanism for rotating the display portion with respect to thebody portion. In some instances, the electronics source module forms adisk shape. The electronics source module may provide data in both 2Dand 3D formats, and in some cases, can provide a single and/or dualoutput. The headset may feature a holding structure (e.g., a springmechanism, a snap connector, a latch, a catch, a detent, a ratchetingmechanism, etc.) for maintaining the display portion in at least one ofthe immersed position and the non-immersed position.

In general, in another aspect, embodiments of the invention feature amethod of configuring an immersive headset device. The method caninclude the steps of providing a body portion to be worn on a head of auser; providing a display portion movably attached to a front of thebody portion, the display portion having at least one display and beingconfigured to move between an immersed position in which the display isin a line-of-sight of the user and a non-immersed position; anddisposing an electronics source module for housing at least one of powerand display signal electronics at a rear of the body portion.

In various embodiments, the body portion may include semi-rigid sideframe members. In such embodiments, the method can further includeinterconnecting the semi-rigid side frame members about the rear of thehead with a strap assembly. In such embodiments, the electronics sourcemodule can form part of the strap assembly. In some instances, thedisplay may include one or more microdisplays, which in some cases, havea diagonal dimension in a range from about 0.5 inches to about 1.5inches. In some cases, the headset may include two microdisplays, onefor each eye of the user. In such cases, the method can further includeinterconnecting each microdisplay to the electronics source module withan independent input.

In various embodiments, the display portion can move between theimmersed position and the non-immersed position by rotating with respectto the body portion. In some instances, the electronics source moduleforms a disk shape. The electronics source module may provide data inboth 2D and 3D formats. In certain embodiments, the method may furtherinclude providing a holding structure for maintaining the displayportion in at least one of the immersed position and the non-immersedposition. The method can also include interconnecting the electronicssource module to the display portion with at least one cable.

In general, in another aspect, embodiments of the invention feature animmersive headset device having other features. The headset can includea body portion to be worn on a head of a user and a display portionmovably attached to the body portion and having at least one display. Insome instance the display portion may transition between a VR mode andan AR mode. In some cases, when the display portion is in the VR mode,the displays are in a line-of-sight of a user; and, when the displayportion is in the AR mode, the displays are displaced from theline-of-sight of the user while providing an image to the user.

In various embodiments, the headset can include a reflective structuredisposed in the line-of-sight during the AR mode. The reflectivestructure may include a flat plate combiner. In some instances, the flatplate combiner has both reflective and transmissive properties. In somesuch instances, when the display portion is in the VR mode, the flatplate combiner is not in the line-of-sight of the user; and when thedisplay portion is in the AR mode, the flat plate combiner is at leastpartially in the line-of-sight of the user such that (i) the user cansee through the flat plate combiner, and (ii) the display reflects theimage to the user off the flat plate combiner. The flat plate combinermay have a partially reflective surface, an angular reflective surface,and/or a notch coating. When the display portion is in the AR mode, theflat plate combiner may form an acute angle with the line-of-sight ofthe user. In certain embodiments, the headset also includes anelectronics source module that can (i) make a determination of whetherthe displays are in the VR mode or the AR mode, and (ii) apply an imagecorrection (e.g., a brightness adjustment, a contrast adjustment, asharpness adjustment, an image flip, etc.) to the image based on thedetermination.

In general, in another aspect, embodiments of the invention feature amethod of using an immersive headset device. The method may include thesteps of wearing a body portion of the immersive headset device about ahead of a user; and transitioning a display portion, having at least onedisplay, between a VR mode and an AR mode, such that (i) when thedisplay portion is in the VR mode, the displays are in a line-of-sightof a user, and (ii) when the display portion is in the AR mode, thedisplays are displaced from the line-of-sight of the user whileproviding an image to the user.

In various embodiments, the transitioning step can further includetransitioning a reflective structure between an AR mode position and aVR mode position, where the reflective structure is disposed in theline-of-sight in the AR mode position. In some cases, the reflectivestructure includes a flat plate combiner. In some instances, the flatplate combiner has both reflective and transmissive properties. In somesuch instances, in the VR mode position, the flat plate combiner is notin the line-of-sight of the user; and, in the AR mode position, the flatplate combiner is at least partially in the line-of-sight of the usersuch that (i) the user can see through the flat plate combiner, and (ii)the display reflects the image to the user off the flat plate combiner.The flat plate combiner may have a partially reflective surface, anangular reflective surface, and/or a notch coating. In the AR mode, theflat plate combiner may form an acute angle with the line-of-sight ofthe user. In some instances, the method further includes making adetermination of whether the displays are in the VR mode or the AR mode,and applying an image correction (e.g., brightness adjustment, acontrast adjustment, a sharpness adjustment, an image flip, etc.) to theimage based on the determination.

BRIEF DESCRIPTION OF THE FIGURES

In the drawings, like reference characters generally refer to the sameparts throughout the different views. Also, the drawings are notnecessarily to scale, emphasis instead generally being placed uponillustrating the principles of the invention. In the followingdescription, various embodiments of the present invention are describedwith reference to the following drawings, in which:

FIG. 1A is a schematic diagram of an immersive headset device being wornin a “flipped-down” position, according to one embodiment;

FIG. 1B is a schematic diagram of the immersive headset device of FIG.1A being worn in a “flipped-up” position, according to one embodiment;

FIG. 2 is a chart providing example minimum, maximum, and nominalparameter values for various features of a headset, according to variousembodiments.

FIG. 3A-3C are schematic perspective views showing various adjustmentmechanisms of an example headset, according to various embodiments;

FIGS. 4A-4B show schematic perspective views of an example headsethaving an electronics source module at the rear, according to oneembodiment;

FIGS. 5A-5C show example schematic side exterior, side transparent, andside partial cutaway views of the headset optics in VR mode, accordingto one embodiment;

FIGS. 6A-6B show example schematic exterior and transparent views of theheadset optics in AR mode, according to one embodiment;

FIGS. 7A-7B show example viewable areas presented by the headsetdisplays, according to various embodiments;

FIG. 8 shows a schematic exploded view of an example display housing,according to one embodiment; and

FIGS. 9A-9B show example light travel paths within the optics ofdisplays used in various embodiments.

DESCRIPTION

Embodiments of the technology disclosed herein include an immersiveheadset that may incorporate technology such as, for example,microdisplays and co-axial reflective optical systems. In someinstances, the headset may include a Microdisplay Based ImmersiveHeadset (MBIHS) which exhibits significant advancements overconventional immersive headsets. The MBIHS may be implemented to includea wide field-of-view (e.g., exceeding ninety degrees), which is normallyachieved only by using larger displays and conventional refractiveoptics.

With display technology such as that disclosed herein, embodiments of anMBIHS can be made in a form that is very lightweight and compact. Forexample, microdisplays that have a diagonal of less than 1 inch (25 mm)can be used. In other embodiments, microdisplays having a diagonalmeasurement in the range of 0.5 inch to 1.5 inch (13 mm to 38 mm) can beused.

In various embodiments, folded optical systems can be used to facilitatea compact form factor. Examples of co-axial reflective optical systemsthat can be used with embodiments of the MBIHS include, for example,those described in U.S. Pat. Nos. 6,853,491 and 6,271,969 (and variantsthereof), each of which are incorporated by reference herein in theirentirety.

The small size of the headset described herein allows it to includefeatures not possible or impractical with conventional immersiveheadsets that do not incorporate microdisplays. One such featureincludes a display portion having a “flip-up”/“flip-down” capability.This allows the user to flip the display portion into and out of theuser's line-of-sight, to transition between being immersed in the MBIHSand being able to see the real world. This feature can allow a user totransition between the real world and the virtual environment morerapidly than conventional headsets, without needing to remove and/orreseat the headset.

FIGS. 1A-1B are diagrams illustrating examples of this flip-up/flip-downcapability. In FIGS. 1A-1B, a user is wearing an example immersiveheadset 100 featuring examples of the technology disclosed herein. Invarious embodiments, the headset 100 may include a display portion 102for housing at least one display, and a body portion 104 adapted toengage a user's head. In this example, the display portion 102 includesa pair of displays (e.g., a left display 106 a and a right display 106b) which can be implemented, for example, using microdisplaysincorporating a variety of different technologies. For example, LED,OLED, LCD, and other display types can be used. Although in someembodiments two displays may be provided (e.g., one for each eye), ingeneral any number of displays can be provided. For example, a singledisplay to cover both eyes may be used. In embodiments incorporatingmultiple displays, the displays may present multiple images to the userat the same time. In some cases, different information or content can beprovided to different displays. The different content can be provided atthe same time, or in some cases a user and/or a controller can elect foronly a single content input to be provided at a particular time.

In FIG. 1A, the display portion 102 is shown in an example flipped-downposition such that the displays 106 a, 106 b are in the user'sline-of-sight and the information on the displays is presented forviewing to the user. In FIG. 1B, the displays are shown in an exampleflipped-up position such that they are out of the user's line-of-sight.In the flipped-down position, the headset 100 can be considered to be inthe immersive or deployed mode. In other embodiments, the displays 106a, 106 b may be pivoted, rotated, or translated to the right or left,outside of the user's field of view.

Any of a number of different mechanisms can be used to allow thedisplays to be flipped, rotated, or moved. For example, pin-and-barreltype hinge configurations, as well as other hinge or pivot mechanisms,can be used to allow the displays to be flipped up or flipped down asdesired. Spiral or torsion springs or other like mechanisms (e.g., aclock spring) can be used to apply pressure to the hinged elements tofacilitate movement in one direction while providing some level ofresistance to movement in the other direction, or simply to hold thedisplay portion 102 in a particular position. This feature can ensurethat a user need not manually hold the display portion 102 in thedesired position even in adverse conditions (e.g., while riding in amilitary vehicle over rough terrain, in an aircraft, etc.). For example,the spring mechanism can be used to hold the display portion 102 in aviewable position in the user's line-of-sight without the displayportion 102 jostling or bouncing out of view. Similarly, a springmechanism can be used to maintain the display portion 102 in theflipped-up position so as to not interfere with the user's line-of-sight(e.g., by jostling or bouncing into the user's field-of-view). Othermechanisms (e.g., snap connectors, latches, catches, detents, ratchetingmechanisms, etc.) can similarly be used to maintain the display portion102 at a desired position.

In various embodiments, the display portion 102 and body portion 104 canbe configured such that a minimum quantity of exterior light reaches theuser's eyes when the display portion 102 is flipped down in theimmersive mode. This can help to improve the “signal-to-noise” ratio forthe user, and provide a better viewing experience. This can also allowthe headset 100 to consume less power by requiring a lesser degree ofbrightness in the displays to overcome exterior light. FIG. 8 shows anexploded view of an example display housing 800 that can form part ofthe display portion 102. As shown, foam 802, padding 804, or othercompressible or resilient materials can be used to provide a light-tightseal for the headset 100, despite variations in the physical attributesof a particular user (e.g., head shape, bone structure, etc.). In someinstances, such sealing materials are furnished in black or flat blackto further facilitate limiting external light from entering the interiorof the headset 100. As shown in FIGS. 1A and 1B, the entire headset 100may be black to absorb light and avoid reflections. In otherembodiments, the exterior of the headset 100 can be provided in variousother different colors including, for example, various camouflage colorsand patterns as may be specified by one or more military branches (e.g.,Universal Camouflage Pattern (UCP)®, MultiCam®, Desert CamouflageUniform®, etc.). Regardless of the exterior color, the interior of theheadset 100 may be black or flat black, e.g., to avoid or reducereflections.

As noted above, the microdisplays 106 a, 106 b can be of a smaller sizethan displays currently used in immersive headsets. For example, themicrodisplays 106 a, 106 b can measure in a range from about 0.5 inchesto 1.5 inches on the diagonal dimension. Such a small form factor may bepossible by taking advantage of co-axial reflective optical systems(sometimes referred to as “pancake optics”). Optical amplificationrequires light to travel a certain physical distance in order to gain adesired magnification. A co-axial reflective optical system minimizesthe geometric space required for the light to travel a particularphysical distance by taking advantage of internal reflections within adisplay housing, which allows the light to travel the required physicaldistance within the optical system rather than through free space, aswith conventional optics. Examples of the light travel paths within theoptical system of the displays described herein are shown in FIGS.9A-9B. This results in a much more compact display. In some embodiments,rectangular displays can be used that include standard aspect ratiossuch as, for example, 16:9, 4:3, 5:4, 16:10, 256:135, etc. In otherembodiments, other form factors can be used for the displays including,for example, circular, ovate, or other symmetrical or irregular shapes.

The microdisplays 106 a, 106 b may be adapted to display images having anumber of different resolutions. Some example resolutions include:1024×576, 1152×648, 1280×720, 1600×900, 1920×1080, 2560×1440, 3840×2160,1366×768, 1920×1200, 1280×1024, 800×600, 1000×1000, 2000×2000, etc. Insome instances, a user's viewable area may be a circumscribed geometry(e.g., a circle) of a particular rectangular (or square) resolution. Forexample, as shown in FIG. 7A, the user's vieweable area may be a circlecircumscribed from a square having a 2000×2000 resolution. In otherinstances, it may be desirable for a user's viewable area to be arectangular shape. Non-exclusive examples of such instances may include,situations in which menus are presented in the corners of the viewablearea, or a cinematic experience in which viewing the entire screen isdesirable. In some such instances, the user's viewable area can be theentire display. In other such instances, in order to use the samedisplay as for a circumscribed circle (or other shape) viewable area,the rectangular resolution can be circumscribed out of the circumscribedcircle (or other shape). An example of this technique is shown in FIG.7B. As the above examples illustrate, the microdisplays 106 a, 106 b mayfeature a number of different aspect ratios, shapes, and resolutions invarious embodiments. FIG. 2 is a chart providing example minimum,maximum, and nominal parameter values for various features of theheadset 100.

In various embodiments, the headset 100 may also exhibit variousadjustment capabilities. Examples of such capabilities are shown in FIG.3, which shows an interpupillary distance (IPD) adjust mechanism 302, adiopter adjust mechanism 304, an alignment adjust mechanism 306, and anin/out adjustment mechanism 308 (e.g., to accommodate users of differingeye setback profiles). In various instances, the headset 100 describedherein can include all, none, or any combination of these adjustmentmechanisms. In some instances, some or all of the adjustment mechanismsare positioned with actuation accessible on the exterior of the headset100 to allow adjustment without the need to remove the headset 100 orchange a lens. In some cases the IPD adjust mechanism 302 includes arail system having detents that hold the displays at various distancesapart. In some cases, the independent diopter adjustment 304 can allowusers to focus the displays to the user's eyesight, such that theheadset 100 can be used without eyeglasses. The various adjustmentmechanisms can all be manufactured in a single mechanical structure 300optimized for use as an OEM module.

In various embodiments, the headset 100 may include an electronicssource module 402, which may include the drive electronics for themicrodisplays 106 a, 106 b. As shown in FIG. 4A, one or more cables 406can be included and routed from the electronics source module 402 to thedisplays 106 a, 106 b to provide signals and/or power to displays 106 a,106 b. In some cases, the cables 406 may be routed to the displaysthrough the hinge 504 linking the display portion 102 and the bodyportion 104 (see also FIG. 3C). The electronics source module 402 may beformed in a puck-shaped disk. In some instances, the disk is located atthe rear of the headset 100, which may provide an advantageous weightdistribution of the headset 100 about the user's head. Such a weightdistribution can offer the user ergonomic and other benefits, notoffered by the weight distribution of conventional headsets (e.g.,cantilevered towards the front of the user's head). As shown in FIG. 4B,the electronics source module 402 may be located on a support 408 (e.g.,head strap, elastic bands, etc.) on the rear of the user's head. Such asupport 408 may ensure proper placement of the body portion 104 and thedisplay portion 102 on the head (including the electronics source module402 and microdisplays 106 a, 106 b). In certain embodiments, the cablesare run from the electronics source module 402 to the displays alongsemi-rigid side frames 404 of the headset 100. The body portion 104 mayinclude a strap assembly that connects the side frames 404 about therear of the user's head. In some instances, the electronics sourcemodule 402 can provide and/or receive dual, DisplayPort 1.2industry-standard inputs/outputs. In other instances, the electronicssource module 402 supports single inputs/outputs, either in addition to,or as an alternative from, dual inputs/outputs. The electronics sourcemodule 402 may support data at high rates, e.g., up to 4K resolution at120 Hz, and can support all available 2D and 3D formats.

In other embodiments, drive electronics may be removed from the front ofthe headset by running electronic cables to drive electronics that arecarried, for example, in or on the user's uniform or clothing (e.g., ina backpack or a belt pack). In such embodiments, rather than theelectronics source module 402 including the drive electronics themselves(as described above), the electronics source module 402 may collect androute cables to the drive electronics worn by the user.

In some embodiments, an electrical connector can be provided to allowthe headset 100 to electrically connect and disconnect from the driveelectronics. In some cases, the headset 100 can connect directly to thedrive electronics. In other cases, the headset 100 can connectindirectly to the drive electronics via one or more interveningcommunication paths. Such paths can include, for example, a wearablenetwork that may be embedded in military or civilian clothing. In someembodiments, an electrical connector can be provided to allow theheadset 100 to operate wirelessly by receiving signal information (e.g.,video, audio, etc.) over a radio frequency or other wireless link. Insuch embodiments, power may be provided to the headset 100 withbatteries, PV cells, capacitor storage cells or other portable powersources.

The headset 100 can further include speakers, transducers, or otheractuators to provide sound or vibratory signals to a user. In someinstances, the sound can be provided in conjunction with the imagesprovided from the display portion 102. In some embodiments, in additionto, or as an alternative from, conventional speakers, ear buds or otherlike audio mechanisms may be used. In some cases, bone conductiontransducers can be provided to enable delivery of audio content to be auser's inner ear via conduction through one or more bones in the user'shead such as, for example, the temporal bone, the occipital bone, theparietal bone, etc.

In various embodiments, the flip-up/flip-down capability allows theheadset 100 to feature a VR mode, when the display portion 102 is in theflipped-down position, and an AR mode, when the display portion 102 isin the flipped-up position. FIGS. 5A-5C show an example configuration ofthe headset in VR mode, and FIGS. 6A-6B show an example configuration ofthe headset in AR mode. In general, in such embodiments, when thedisplay portion 102 is in VR mode, the displays 106 a, 106 b are in aline-of-sight of the user, and when the display portion 102 is in ARmode, the displays 106 a, 106 b are displaced from the line-of-sight ofthe user while still providing an image to the user. In order to providean image to the user in AR mode, the displays 106 a, 106 b may reflectan image off a reflective structure to the user. In such embodiments,the device may feature a flat plate combiner 502 having bothtransmissive and reflective properties. In some cases, the flat platecombiner 502 features a partially reflective surface, an angularreflective surface, and/or a notch coating applied to optimize theseproperties. As shown in FIGS. 5A-5B, the flat plate combiner 502 may notbe used in the VR mode, as the user's eye is directly in line with thedisplays 106 a, 106 b. But in AR mode, as shown in FIGS. 6A-6B, the flatplate combiner 502 may rotate into an angled position from which it (i)is transmitted by the user's line-of-sight 602; and (ii) reflects animage from the displays 106 a, 106 b. Thus, in AR mode, a user can bothsee into the real world and be presented with virtual and/or enhancedoptics. As one illustrative example of this feature, a user may be ableto see the real world but also be presented with a virtual display(e.g., at the peripherals of the user's view) of certain externalparameters (e.g., temperature, wind speed, date/time, etc.).

In order to transition between VR mode and AR mode, the flat platecombiner 502 may rotate about a hinge 504. Various structures can beused to drive the flat plate combiner 502 to ensure that it is reliablyand repeatable positioned in the correct position (e.g., a linkagestructure, a cam and follower, a rack and pinion, etc.). In the AR mode,the correct position may be the correct angle to ensure that a user cansee through the combiner 502, and that the combiner 502 can properlyreflect the displayed image. In the VR mode, the correct position may bea position in which the combiner's optical surfaces are protected (e.g.,by the display housing).

In some embodiments, the electronics source module 402 (or otherelectronic/software system) can determine when the headset 100 is in ARmode or VR mode and adjust the image parameters accordingly. Forexample, when the headset 100 is in AR mode, the displays may be subjectto more ambient light, which can require that the images be presentedwith altered (e.g., higher) brightness, contrast, sharpness, and/orother image parameters. As another example, because the displays changeorientation during the transition between AR mode and VR mode, such atransition may require that the image be flipped (an image flip), sothat it is displayed in the correct orientation in both modes. Invarious embodiments, the electronics source module 402 (or otherelectronics/software) can make these adjustments, and other adjustments,based on a determination of whether the headset 100 is in AR mode or VRmode.

While various embodiments of the disclosed technology have beendescribed above, it should be understood that they have been presentedby way of example only, and not of limitation. Likewise, the variousdiagrams may depict an example architectural or other configuration forthe disclosed technology, which is done to aid in understanding thefeatures and functionality that can be included in the disclosedtechnology. The disclosed technology is not restricted to theillustrated example architectures or configurations, but the desiredfeatures can be implemented using a variety of alternative architecturesand configurations. Indeed, it will be apparent to one of skill in theart how alternative functional, logical or physical partitioning andconfigurations can be implemented to implement the desired features ofthe technology disclosed herein. Also, a multitude of differentconstituent module names other than those depicted herein can be appliedto the various partitions. Additionally, with regard to flow diagrams,operational descriptions and method claims, the order in which the stepsare presented herein shall not mandate that various embodiments beimplemented to perform the recited functionality in the same orderunless the context dictates otherwise.

The technology disclosed herein, in accordance with one or more variousembodiments, is described in detail with reference to the includeddrawings. The drawings are provided for purposes of illustration onlyand merely depict typical or example embodiments of the disclosedtechnology. These drawings are provided to facilitate the reader'sunderstanding of the disclosed technology and shall not be consideredlimiting of the breadth, scope, or applicability thereof. The inventioncan be practiced with modification and alteration, and that thedisclosed technology be limited only by the claims and the equivalentsthereof. It should be noted that for clarity and ease of illustrationthese drawings are not necessarily made to scale. Other features andaspects of the disclosed technology are apparent from the above detaileddescription, taken in conjunction with the accompanying drawings, whichillustrate, by way of example, the features in accordance withembodiments of the disclosed technology.

Although the disclosed technology is described above in terms of variousexemplary embodiments and implementations, it should be understood thatthe various features, aspects and functionality described in one or moreof the individual embodiments are not limited in their applicability tothe particular embodiment with which they are described, but instead canbe applied, alone or in various combinations, to one or more of theother embodiments of the disclosed technology, whether or not suchembodiments are described and whether or not such features are presentedas being a part of a described embodiment. Thus, the breadth and scopeof the technology disclosed herein should not be limited by any of theabove described exemplary embodiments.

Terms and phrases used in this document, and variations thereof, unlessotherwise expressly stated, should be construed as open ended as opposedto limiting. As examples of the foregoing: the term “including” shouldbe read as meaning “including, without limitation” or the like; the term“example” is used to provide exemplary instances of the item indiscussion, not an exhaustive or limiting list thereof; the terms “a” or“an” should be read as meaning “at least one,” “one or more” or thelike; and adjectives such as “conventional,” “traditional,” “normal,”“standard,” “known” and terms of similar meaning should not be construedas limiting the item described to a given time period or to an itemavailable as of a given time, but instead should be read to encompassconventional, traditional, normal, or standard technologies that may beavailable or known now or at any time in the future. Likewise, wherethis document refers to technologies that would be apparent or known toone of ordinary skill in the art, such technologies encompass thoseapparent or known to the skilled artisan now or at any time in thefuture.

The presence of broadening words and phrases such as “one or more,” “atleast,” “but not limited to” or other like phrases in some instancesshall not be read to mean that the narrower case is intended or requiredin instances where such broadening phrases may be absent. The use of theterm “module” does not imply that the components or functionalitydescribed or claimed as part of the module are all configured in acommon package. Indeed, any or all of the various components of amodule, whether control logic or other components, can be combined in asingle package or separately maintained and can further be distributedin multiple groupings or packages or across multiple locations.

Additionally, the various embodiments set forth herein are described interms of exemplary block diagrams, flow charts and other illustrations.As will become apparent to one of ordinary skill in the art afterreading this document, the illustrated embodiments and their variousalternatives can be implemented without confinement to the illustratedexamples. For example, block diagrams and their accompanying descriptionshould not be construed as mandating a particular architecture orconfiguration.

What is claimed is:
 1. An immersive headset device comprising: a bodyportion adapted to be worn on a head of a user; a display portionmovably attached to a front of the body portion, the display portioncomprising at least one display and adapted to move between an immersedposition in which the displays are in a line-of-sight of the user and anon-immersed position; and an electronics source module for housing atleast one of power and display signal electronics located at a rear ofthe body portion.
 2. The immersive headset of claim 1, wherein the bodyportion comprises semi-rigid side frame members.
 3. The immersiveheadset of claim 2, wherein the body portion further comprises a strapassembly adapted to connect the semi-rigid side frame members about therear of the head, the electronics source module forming part of thestrap assembly.
 4. The immersive headset of claim 3, wherein theelectronics source module is shaped to hold the strap assembly in anappropriate location on the head.
 5. The immersive headset of claim 1,wherein the display portion further comprises a diopter adjust mechanismand an interpupillary distance adjust mechanism.
 6. The immersiveheadset of claim 5, wherein at least one of the diopter adjust mechanismand the interpupillary distance adjust mechanism is adapted to beadjusted without removing the headset from the head of the user.
 7. Theimmersive headset of claim 1, wherein the display comprises at least onemicrodisplay.
 8. The immersive headset of claim 7, wherein themicrodisplays comprise a diagonal dimension in a range from about 0.5inches to about 1.5 inches.
 9. The immersive headset of claim 7, whereinthe microdisplays display an image having a resolution selected from thegroup consisting of 1024×576, 1152×648, 1280×720, 1600×900, 1920×1080,2560×1440, 3840×2160, and 1366×768.
 10. The immersive headset of claim7, wherein the microdisplays comprise two microdisplays comprising onemicrodisplay for each eye of the user.
 11. The immersive headset ofclaim 10, wherein each microdisplay is adapted to receive an independentinput from the electronics source module.
 12. The immersive headset ofclaim 1, wherein the display portion is adapted to move between theimmersed position and the non-immersed position by rotating with respectto the body portion.
 13. The immersive headset of claim 12, furthercomprising a hinge mechanism adapted to rotate the display portion withrespect to the body portion.
 14. The immersive headset of claim 1,wherein the electronics source module forms a disk shape.
 15. Theimmersive headset of claim 1, wherein the electronics source module isadapted to provide data in both 2D and 3D formats.
 16. The immersiveheadset of claim 1, wherein the electronics source module is adapted toprovide at least one of a single and a dual output.
 17. The immersiveheadset of claim 1, further comprising a holding structure adapted tomaintain the display portion in at least one of the immersed positionand the non-immersed position.
 18. The immersive headset of claim 17,wherein the holding structure is selected from the group consisting of aspring mechanism, a snap connector, a latch, a catch, a detent, and aratcheting mechanism.
 19. A method of configuring an immersive headsetdevice, the method comprising the steps of: providing a body portionadapted to be worn on a head of a user; providing a display portionmovably attached to a front of the body portion, the display portioncomprising at least one display and adapted to move between an immersedposition in which the display is in a line-of-sight of the user and anon-immersed position; and disposing an electronics source module forhousing at least one of power and display signal electronics at a rearof the body portion.
 20. The method of claim 19, wherein the bodyportion comprises semi-rigid side frame members.
 21. The method of claim20, further comprising interconnecting the semi-rigid side frame membersabout the rear of the head with a strap assembly, the electronics sourcemodule forming part of the strap assembly.
 22. The method of claim 19,wherein the display comprises at least one microdisplay.
 23. The methodof claim 22, wherein the microdisplays comprise a diagonal dimension ina range from about 0.5 inches to about 1.5 inches.
 24. The method ofclaim 22, wherein the microdisplays comprise two microdisplayscomprising one microdisplay for each eye of the user.
 25. The method ofclaim 24, further comprising interconnecting each microdisplay to theelectronics source module with an independent input.
 26. The method ofclaim 19, wherein the display portion is adapted to move between theimmersed position and the non-immersed position by rotating with respectto the body portion.
 27. The method of claim 19, wherein the electronicssource module forms a disk shape.
 28. The method of claim 19, whereinthe electronics source module is adapted to provide data in both 2D and3D formats.
 29. (canceled)
 30. (canceled)
 31. An immersive headsetdevice comprising: a body portion adapted to be worn on a head of auser; a display portion movably attached to the body portion, thedisplay portion comprising at least one display and adapted totransition between a VR mode and an AR mode, wherein, (i) when thedisplay portion is in the VR mode, the displays are in a line-of-sightof a user, and (ii) when the display portion is in the AR mode, thedisplays are displaced from the line-of-sight of the user whileproviding an image to the user. 32-38. (canceled)
 39. A method of usingan immersive headset device, the method comprising the steps of: wearinga body portion of the immersive headset device about a head of a user;transitioning a display portion comprising at least one display betweena VR mode and an AR mode, such that (i) when the display portion is inthe VR mode, the displays are in a line-of-sight of a user, and (ii)when the display portion is in the AR mode, the displays are displacedfrom the line-of-sight of the user while providing an image to the user.40-46. (canceled)